INTERMOLD Die & Mold Asia Japan Metal Stamping Technorogy Exhibition

ABOUT THE SHOW

アップコン株式会社

Exhibitor name
アップコン株式会社
UPCON CORPORATION
Address

〒213-0012

神奈川県

川崎市高津区坂戸3-2-1

KSP東棟611

Website https://www.upcon.co.jp/
PR message We rapidly repair sunken, uneven factory floors and subsurface voids caused by earthquakes or subsidence using rigid polyurethane foam, with zero downtime. Uneven floors disrupt AGVs, hindering productivity and quality. Visit the Upcon booth for floor solutions!
The Main Item

Movie
Category of
Exhibit Items