INTERMOLD Die & Mold Asia Japan Metal Stamping Technorogy Exhibition / AM EPO

NEWS

Aug.01.2024
The application for INTERMOLD/ Die and Mold Asia/ Japan Metal Stamping Techology Exhibition/ AM EXPO 2025 has started.
Visit the link for the show detail.
Jul.01.2024
INTERMOLD/ Die and Mold Asia/ Japan Metal Stamping Technology Exhibition/ AM EXPO will be held on April 16-18, 2025 in Tokyo!
We will return to Osaka and Nagoya in 2026.
Jun.03.2024
Now you can download "FLOOR MAP for Nagoya"
May.10.2024
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Office relocation announcement
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INTERMOLD office move to the below address after May 13th.
1-1-7, Otemae, Chuo-ku, Osaka 540-0008 Japan
TEL +81-6-6944-9911
Phone & Fax number is not changed.
May.01.2024
Pre-registration for Nagoya is opened.

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