INTERMOLD Die & Mold Asia Japan Metal Stamping Technorogy Exhibition

ABOUT THE SHOW

新日産ダイヤモンド工業株式会社

Exhibitor name
新日産ダイヤモンド工業株式会社
Shin-Nissan Diamond Tools MFG. Co., LTD.
Booth NO. 3-311-8
Address

〒236-0002

神奈川県

横浜市金沢区鳥浜町2番30

2-30 Torihama-cho Kanazawaku Yokohama Japan

Website https://sndia.co.jp
Email
Phone number +81457718641
The Main Item

Details[1]

In addition to ultra-precision cutting blades, metal bonds, and resin blades for electronic and semiconductor manufacturing, our seprex blades with polyimide resin as a matrix and our unique metal bonds have been trusted by customers for many years with high rigidity.
It is particularly effective in cutting semiconductor packages, ceramic products, and glass products.
Details[2]

Pure domestic polyimide resin with fast delivery, high quality, and stable price.
It is an engineering plastic with excellent heat resistance, mechanical properties, sliding properties, water absorption, electrical properties, workability, etc.
Each grade has its own characteristics, so it is a lineup that can meet the needs of customers.
It has been adopted in the aviation and space industries, semiconductor manufacturing equipment, liquid crystal industry, etc.
Details[3]

Using polyimide resin as the base material and diamond abrasive grains as an abrasive, this polishing sheet is characterized by its "heat resistance", "long life", and "resistance to clogging". 
It is a polishing sheet that does not easily shed abrasive grains, is less likely to cause secondary grinding, and has less contamination from the sheet.
Ideal for polishing and polishing. We have a lineup of sponge types for new series (Kirat Carat) mold polishing.
It can also be used for surface polishing after wire EDM and maintenance in the mass production process.
Category of
Exhibit Items

A. MOLDS, MOLD MATERIALS

Formed Products

Others

D. CUTTING TOOLS

Diamond Tools

E. MACHINE TOOLS, POLISHING WHESTONES

Deburring Tools

Others