INTERMOLD/Die & Mold Asia/Japan Metal Stamping Technology Exhibition

NEWS

Aug.21.2025: NEWWe will hold a new fair, “Human Resource Development & Skills Transfer Fair.”
Jul.24.2025: INTERMOLD Osaka will be held in April and INTERMOLD Nagoya will be held in May 2026.
English page has been renewed. Please download the exhibition brochure at
"For exhibitor page"
Jul.01.2024: INTERMOLD/ Die and Mold Asia/ Japan Metal Stamping Technology Exhibition/ AM EXPO will be held on April 16-18, 2025 in Tokyo!
We will return to Osaka and Nagoya in 2026.
Jun.03.2024: Now you can download "FLOOR MAP for Nagoya"
May.10.2024: ＝＝＝
Office relocation announcement
＝＝＝
INTERMOLD office move to the below address after May 13th.
1-1-7, Otemae, Chuo-ku, Osaka 540-0008 Japan
TEL +81-6-6944-9911
Phone & Fax number is not changed.