INTERMOLD/Die & Mold Asia/Japan Metal Stamping Technology Exhibition

NEWS

Jul.01.2024: INTERMOLD/ Die and Mold Asia/ Japan Metal Stamping Technology Exhibition/ AM EXPO will be held on April 16-18, 2025 in Tokyo!
We will return to Osaka and Nagoya in 2026.
Jun.03.2024: Now you can download "FLOOR MAP for Nagoya"
May.10.2024: ＝＝＝
Office relocation announcement
＝＝＝
INTERMOLD office move to the below address after May 13th.
1-1-7, Otemae, Chuo-ku, Osaka 540-0008 Japan
TEL +81-6-6944-9911
Phone & Fax number is not changed.
May.01.2024: Pre-registration for Nagoya is opened.
Mar.25.2024: INTERMOLD 2025 and AM EXPO Tokyo will be held on April 16-18. 2025 at Tokyo Big Sight.　It will NOT be held in Nagoya in 2025.
INTERMOLD Osaka and Nagoya will back in 2026.