EXHIBITOR SEARCH
株式会社積層金型
| Exhibitor name |
株式会社積層金型
SEKISOU KANAGATA Co., LTD
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|---|---|
| Booth NO. | B-121-21 |
| Address |
〒737-0134 広島県 呉市広多賀谷2-3-12 2-3-12 Hirotagaya, Kure-shi,Hiroshima,737-0134,Japan |
| Website | http://www.sekisou.com |
| Phone number | +81-823-73-4565 |
| PR message | Details of Business □ High-cycle Resin Mold Die Diffusion bonding laminated dies and diffusion bonding laminated blocks (Available for selection for processes from waterway design to finishing) Features:The waterway in the die can be set to match the shape, enabling improved cooling performance and reduced molding cycle time |
| The Main Item |
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| The name of Item[1] | Diffusion bonding laminated dies |
| Details[1] |
High-cycle Resin Mold Die Diffusion bonding laminated dies and diffusion bonding laminated blocks (Available for selection for processes from waterway design to finishing) Features: The waterway in the die can be set to match the shape, enabling improved cooling performance and reduced molding cycle time |
| Category of Exhibit Items |
A. MOLDS, MOLD MATERIALS Mold Materials Mold Components Formed Products Others |
